Comunicados de imprensa

Indium Corporation will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International

Indium Corporations Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will deliver two technical presentations at the 11th Micro/Nano-Electronics Packaging and

Solder Chemistry, a trusted brand for over 30 years now powered by Indium Corporation, will feature its complete suite of services for PCBA as part of the prestigious Fraunhofer Future Packaging

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in

Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver,

Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on May 16 in Aurora, Colorado. The presentation, Exploring Alternative Solder Alloys

Como um dos principais fornecedores de materiais para a indústria de montagem de eletrónica de potência, os especialistas da Indium Corporation partilharão a sua visão técnica e conhecimentos sobre uma variedade de assuntos relacionados com a indústria

Indium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will

As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation will feature its advanced products designed to meet the evolving challenges of

Indium Corporation Product Manager Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented at the IPC APEX Expo in

Indium Corporations Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications. The webinar, part of

Indium Corporation‘s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics

Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in

Indium Corporation, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 911 in Anaheim, Calif.,

Indium Corporation‘s Principal Engineer Advanced Materials Andy C. Mackie, Ph.D., MSc,  is scheduled to present on day one of the 2024 Critical Materials Council (CMC)

Indium Corporation Corporate Associate Vice President Rick Short is retiring, concluding a distinguished career of 40 years with the global electronics materials manufacturer based in

Indium Corporation will feature an array of its innovative thermal management solutions at SEMI-THERM, March 2528, in San Jose, CA.   Indium

Indium Corporation‘s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in

Indium Corporation, a global leader in materials science and electronics assembly solutions, will commemorate its 90thanniversary on March 13. Indium Corporation’s innovative products,

Indium Corporation, a global leader in materials science and electronics assembly solutions, founded and headquartered in the Mohawk Valley, will commemorate its 90th anniversary on March