Comunicados de imprensa

May 13, 2024

Especialistas da Indium Corporation farão uma apresentação sobre eletrónica de potência na PCIM Europe

Como um dos principais fornecedores de materiais para a indústria de montagem de eletrónica de potência, os especialistas da Indium Corporation partilharão a sua visão técnica e conhecimentos sobre uma variedade de assuntos relacionados com a indústria

May 13, 2024

Especialistas da Indium Corporation farão uma apresentação na Conferência SMTA Electronics in Harsh Environments

Indium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will

May 7, 2024

A Indium Corporation apresentará materiais HIA na ECTC

As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation will feature its advanced products designed to meet the evolving challenges of

April 30, 2024

Especialista da Indium Corporation fará uma apresentação sobre solda sem Pb para fixação de matrizes em aplicações de potência discreta

Indium Corporation Product Manager Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.

April 11, 2024

A Indium Corporation recebe o prémio de introdução de novo produto para pasta de solda sem Pb e com baixo deslizamento

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented at the IPC APEX Expo in

April 9, 2024

A Indium Corporation organizará um webinar gratuito sobre pasta de solda sem chumbo para aplicações automotivas

Indium Corporations Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications. The webinar, part of

April 2, 2024

Sze Pei Lim, da Indium Corporations, fará uma apresentação sobre embalagens de semicondutores no ICEP Japão

Indium Corporation‘s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics

March 28, 2024

A Indium Corporation irá apresentar e expor no EPP InnovationsFORUM

Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in

March 26, 2024

A Indium Corporation e os parceiros da indústria apresentarão os seus produtos ao vivo na APEX

Indium Corporation, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 911 in Anaheim, Calif.,

March 21, 2024

Especialista técnico da Indium Corporation fará uma apresentação na Conferência do Conselho de Materiais Críticos

Indium Corporation‘s Principal Engineer Advanced Materials Andy C. Mackie, Ph.D., MSc,  is scheduled to present on day one of the 2024 Critical Materials Council (CMC)

March 20, 2024

Indium Corporations Rick Short to Retire After 40 Years of Service

Indium Corporation Corporate Associate Vice President Rick Short is retiring, concluding a distinguished career of 40 years with the global electronics materials manufacturer based in

March 19, 2024

Indium Corporation to Feature Innovative Solutions from Portfolio of Thermal Management Products at SEMI-THERM

Indium Corporation will feature an array of its innovative thermal management solutions at SEMI-THERM, March 2528, in San Jose, CA.   Indium

March 14, 2024

Indium Corporation Experts to Present Throughout IPC APEX Expo

Indium Corporation‘s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in

March 13, 2024

A Indium Corporation comemora 90 anos de inovação na ciência dos materiais

Indium Corporation, a global leader in materials science and electronics assembly solutions, will commemorate its 90thanniversary on March 13. Indium Corporation’s innovative products,

March 13, 2024

A Indium Corporation comemora 90 anos de inovação na ciência dos materiais

Indium Corporation, a global leader in materials science and electronics assembly solutions, founded and headquartered in the Mohawk Valley, will commemorate its 90th anniversary on March

March 12, 2024

O Diretor Técnico da Indium Corporation fará uma apresentação no Fórum Tecnológico da SMTA Taiwan

Indium Corporation Senior Area Technical Manager Jason Chou will present at the SMTA Taiwan Tech Forum on March 26 in Taoyuan City, Taiwan. Chou’s presentation

March 6, 2024

Especialistas da Indium Corporation farão uma apresentação na SEMI THERM

Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Milo Lazi will

March 4, 2024

A Indium Corporation apresentará a tecnologia de solda Durafuse e produtos EV na APEX 2024

With more than five million electric vehicles (EVs) on the road with its materials and nearly a decade of experience in the market, Indium Corporation is proud to feature its innovative

February 29, 2024

A Indium Corporation apresentará novos produtos de semicondutores para HIA e SiP na Conferência de Embalagem de Dispositivos IMAPS

As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporationwill feature its advanced products designed to meet the evolving challenges of

February 28, 2024

A Indium Corporation apresentará produtos comprovados para EV e ligas de alta fiabilidade na Productronica China

As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporationis proud to showcase its high-reliability alloys and soldering solutions

February 28, 2024

A Indium Corporation apresenta materiais de interface térmica de metal para queima e teste na TestConX

Indium Corporation is set to showcase its advanced metal thermal interface materials (TIMs) for burn-in and test at TestConX 2024, March 3-6 in Mesa, Ariz., U.S. As a global leader in