CLINTON, N.Y., August 21, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging process challenges at PCIM Asia 2026, August 26-28, in Shenzhen, China.
The presentation, titled Next-Gen Advanced Packaging Materials and System Integration for Power Electronics, examines how advanced interconnection materials and process innovations work together to improve yield, reliability, and manufacturability in next-generation semiconductor packaging. The session will provide insights into breakthrough solutions for thermocompression and laser-assisted bonding, ultra-low residue fluxes, temporary adhesives, and fine-pitch printing technologies that can help manufacturers overcome complex packaging challenges while streamlining production and enhancing device performance.
Leo Hu é gestor técnico sénior da região da China Oriental e trabalha nas instalações da Indium Corporation em Suzhou. Nesta função, gere a equipa regional de apoio técnico e colabora com a organização global da empresa para fornecer soluções de produtos e aplicações aos clientes. Hu conta com 20 anos de experiência na área do encapsulamento de semicondutores, sendo especialista no desenvolvimento de tecnologias avançadas de montagem, na melhoria de processos e na aplicação de materiais de montagem. Apresentou vários artigos técnicos em fóruns globais e conferências académicas e é membro e revisor do Comité Consultivo Técnico da SMTA da China. Hu possui um mestrado em engenharia de circuitos integrados pelo Instituto de Tecnologia da Computação da Academia Chinesa de Ciências e uma licenciatura em ciências pela Universidade de Nankai.
PCIM Asia 2026 visitors can attend Hu’s presentation on Aug 26, 13:30–13:50 p.m. China Standard Time (UTC+8). To learn more about Indium Corporation’s power electronics packaging portfolio, visit indium.com or meet with our experts at PCIM Asia, Hall 16, Booth F30.
Sobre a Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Mexico, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
