Pastas em pó fino
PicoShot® Series Jetting Pastes
Indium Corporation, an innovator in jetting pastes, works closely with Mycronic, one of the leading solder jet printer manufacturers, to offer a simple solution for both small and large-volume solder jetting applications. Utilizing jetting solder paste is increasingly popular for fine-feature assemblies in electronics manufacturing across diverse industries such as automotive and advanced packaging.
Desenvolvido por Indium Corporation
- Controlled Deposition with Minimal Spatter
- Easy Barcode Process Set-Up
- No-Clean or Water-Soluble
Visão geral do produto
Jetting vs. Dispensing
While jetting and dispensing are similar in enabling precise solder deposition on patterns typically unattainable with a stencil, there are some differences. In jetting, there is no Z-axis movement from the jet head or contact with the substrate, leading to enhanced throughput. This necessitates specific rheological adjustments to optimize solder paste for jetting compared to dispensing, whether through flux chemistry or metal load. Our PicoShot® series has been optimized and approved by Mycronic for use in their jetting equipment.
Powder Size and Deposit Size
PicoShot® can accommodate Type 5 and Type 6 solder alloy powder, with particles ranging from 15 to 25 μm for Type 5 and 5-15um for Type 6 in diameter. While larger particles risk clogging the paste ejector, the jetting process allows for additive deposition, enabling substantial paste application even with small powder sizes.
Mycronic “Qualified” vs. Mycronic “Jettable”
When ordering a PicoShot® product, it’s important to distinguish between a “qualified” and a “jettable” product to ensure compatibility and a smooth ordering process. A “qualified” paste has undergone rigorous scale-up testing by both Mycronic and Indium Corporation, verifying key properties such as shelf life and ejector durability. These pastes also feature a barcode, allowing Mycronic jet printers to instantly load the optimal jetting parameters. A “jettable” paste, on the other hand, hasn’t undergone ejector life testing and lacks a barcode but has passed a proof-of-concept jetting test. These are best suited for low-volume applications or when qualified products may not be available.
PicoShot® Series Jetting Paste Products
| Flux Type | Powder Size | Liga metálica | Qualified or Jettable | Minimum Dot Size (μm) | Material |
|---|---|---|---|---|---|
| NC | Type 5 | SAC305 | Qualified | 360 | PicoShot® NC-5M |
| WS | Type 5 | Sn63 | Qualified | 350 | PicoShot® WS-5M |
| NC | Type 6 | SAC305 | Qualified | 230 | PicoShot® NC-6M |
| NC | Type 5 | Sn63 | Jettable | 360 | PicoShot® NC-5M |
Fichas de dados do produto
SnPb PicoShot® NC-5M PDS 100016 R5.pdf
PicoShot® Conditioner C-1 Purging Gel PDS 99769 R1.pdf
Pasta de solda para jato PicoShot® NC-5M PDS 99749 R6.pdf
PicoShot® NC-6M PDS 100212 R1.pdf
Aplicações relacionadas
The PicoShot® Series is suitable for a variety of applications.
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Embalagem e montagem de semicondutores
Critical semiconductor packaging ensures functionality and durability.
Montagem de PCB
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Mercados relacionados
Indium Corporation’s jetting pastes enable simple assembly in markets that require precise solder dot deposition.
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