Indium Corporation‘s senior product specialist Jenny Gallery will deliver a presentation at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico. The presentation, scheduled for April 20, will cover the findings from a technical paper titled AuSn Preform Thickness’s Effect on Thermal Management in Semiconductor Laser Applications.
80Au20Sn is a great choice to ensure good performance and reliability for the plethora of applications that require a high-melting die-attach solder, especially when used in one of its most highly demanded applications: semiconductor laser die-attach. However, the widespread use of semiconductor lasers has been prevented due to the difficulty managing thermal heat transfer. The longevity and potential of these devices become limited when the operational heat increases. One option to improve thermal transfer is the use of a thinner 80Au20Sn preform in the bondline, which allows the heat to transfer to the heat-sink more quickly and efficiently. Defining the voiding percentages for several 80Au20Sn preform thicknessesranging from 0.002″ to 0.00035″ thickallows for conclusions to be drawn on 80Au20Sn preform thickness’s effect on thermal management in semiconductor laser applications.
“At Indium Corporation, we are constantly improving and expanding our capabilities and the development of an innovative material such as the AuLTRA ThInFORMSa product that is four times thinner than the average human hairembodies that core value. In addition to being able to manufacture such a product, generating the data to support its unique qualities authenticates our dependability as a solder materials supplier,” said Gallery. “The opportunity to educate others in the field of electrical and electronic manufacturing on this new technology is a great privilege and I would like to thank IMAPS for giving me the platform to share my expertise at HiTEC.”
As a senior product specialist for the high-temperature business, Gallery is responsible for driving and supporting precious metal-based sales activity and revenue growth by identifying regional market opportunities, leading product and process support, facilitating relationships and driving new business development in the field. She also provides product and process support for solder preforms, wire, ribbon, and paste. Gallery earned her bachelor’s degree in chemistry at the University at Albany. She has past experience as a Pharmaceutical Scientist in the clinical and non-clinical research industry, is certified in TEFL (Teaching English as a Foreign Language), and is also a Certified SMT Process Engineer (CSMTPE).
Giới thiệu về Indium Corporation
Indium Corporation là một nhà tinh chế vật liệu, nhà luyện kim, nhà sản xuất và nhà cung cấp hàng đầu cho các thị trường điện tử, bán dẫn, màng mỏng và quản lý nhiệt toàn cầu. Các sản phẩm bao gồm chất hàn và chất trợ dung; chất hàn; vật liệu giao diện nhiệt; mục tiêu phun; kim loại indium, gali, germani và thiếc và các hợp chất vô cơ; và NanoFoil . Được thành lập vào năm 1934, công ty có hỗ trợ kỹ thuật toàn cầu và các nhà máy đặt tại Trung Quốc, Đức, Ấn Độ, Malaysia, Singapore, Hàn Quốc, Vương quốc Anh và Hoa Kỳ
Để biết thêm thông tin về Indium Corporation, hãy truy cập www.indium.com hoặc gửi email cho Jingya Huang . Bạn cũng có thể theo dõi các chuyên gia của chúng tôi, Từ kỹ sư này đến kỹ sư khác (#FOETA), tại www.linkedin.com/company/indium-corporation/ hoặc @IndiumCorp .
Giới thiệu về IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
