Indium Corporation‘s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto, Japan, on April 19. The presentation will cover the findings from a technical paper, co-authored by R&D Manager for the Alloy Group HongWen Zhang, titled An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305.
In recent years, more interest has been shown in adopting low-temperature solders/materials in various applications in order to decrease the dynamic warpage of highly-integrated packages; reduce energy consumption during assembly; and mitigate risk for temperature-sensitive sensors. Durafuse LT, an In-containing solder paste, was developed and used in mobile phone assembly with a 200C peak reflow temperature profile. Now an increased interest exists for low-temperature processing for first-level interconnects. Therefore, more research is needed to identify any reliability implications for SnAgCu-based bumps creating an interconnect using Durafuse LT solder paste material.
As Senior Global Product Manager for Semiconductor and Advanced Materials, Lim works closely with R&D and manufacturing, and engages with the world’s leading semiconductor companies and contract manufacturers. She is a task force member of the International Electronics Manufacturing Initiative’s (iNEMI) Packaging Technology Integration Group and has co-chaired a number of industry projects and road mapping initiatives over the past five years. She is also on the executive committee of the Institute of Electrical and Electronics Engineers (IEEE) Packaging Society Malaysia Chapter. Lim is a part of the organizing committee for the International Electronics Manufacturing Technology (IEMT). She has authored a number of technical papers and presented regularly in various international technical conferences. She holds a bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers. She is a Certified SMT Process Engineer and has earned her Six Sigma Green Belt designation
Giới thiệu về Indium Corporation
Tập đoàn Indium là một nhà tinh chế, nhà luyện kim, nhà sản xuất và nhà cung cấp vật liệu hàng đầu cho các thị trường điện tử, bán dẫn, màng mỏng và quản lý nhiệt toàn cầu. Các sản phẩm bao gồm chất hàn và chất trợ dung; chất hàn; vật liệu giao diện nhiệt; mục tiêu phun; kim loại indium, gali, germani và thiếc và các hợp chất vô cơ; và NanoFoil . Được thành lập vào năm 1934, công ty có hỗ trợ kỹ thuật toàn cầu và các nhà máy đặt tại Trung Quốc, Đức, Ấn Độ, Malaysia, Singapore, Hàn Quốc, Vương quốc Anh và Hoa Kỳ
Để biết thêm thông tin về Indium Corporation, hãy truy cập www.indium.com hoặc gửi email cho Jingya Huang . Bạn cũng có thể theo dõi các chuyên gia của chúng tôi, Từ kỹ sư này đến kỹ sư khác (#FOETA), tại www.linkedin.com/company/indium-corporation/ hoặc @IndiumCorp .
About ICEP 2023
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics, including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless and components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.
Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.
