Markets Automotive/EV

Automotive/EV

Recent trends in the automotive electronics industry have spurred a surge in components for automobile innovations such as electrification and autonomous driving. In addition, the demand to fit more features and more powerful functions in the space is increasing, thus they must become more reliable than ever. Components must withstand temperature fluctuations, mechanical shocks, vibrations, high-voltage power, humidity, extreme environmental conditions, and higher-density circuit boards, among other challenges.

Indium Corporation offers a suite of proven solutions to overcome these reliability challenges.

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Overview

Proven Products. Enhanced Reliability.

The industry’s challenge lies in minimizing or preventing electrical component failures to enhance consumer safety and lower the costs associated with defective electronics. Such failures can stem from various solder defects, including voids, head-in-pillow issues, insufficiencies, slumping, non-wet opens, dendritic growth, cracking, and warpage.

Indium Corporation’s suite of proven, high-reliability materials, from solder paste to solder preforms, thermal interface materials, innovative solder alloys, metals, and compounds offers enhanced performance in automotive electronics assembly and packaging applications.

Features

10 Million+

and counting

Wide selection of solder alloys and alloy technology

SIR

Exceeds Industry Standard

Our proven Indium8.9HF solder paste series passes and exceeds stringent industry SIR standards

IATF16949:2016

Quality Assurance

Our manufacturing facilities worldwide are integral to a robust quality system, committed to delivering the highest quality assurance for our automotive sector customers.

Related Products

Our wide portfolio of products can cover the electronics assembly needs in various automotive applications from infotainment systems to powertrains.

Comparison of a typical preform and the AuLTRA® ThInFORMS® option, highlighting thickness differences with measurements in mm and inches.

AuLTRA® ThInFORMS®

AuLTRA® ThInFORMS®: Ideal preform for die-attach, enhancing thermal

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Two green containers labeled "Durafuse HR" with the Indium Corporation logo, one cylindrical and one jar-shaped, showcasing premium HR capabilities.

Durafuse® HR

High-reliability & low-voiding Solder Alloy Durafuse®

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Close-up of a film strip showing the logo and text "INDUV" and "SIA" printed on it, set against a blue background.

Heat-Spring®

A renowned soft metal alloy thermal interface

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Exploded view of electronic components and Durafuse® HT paste tubes on a green circuit board background.

Durafuse® HT

High-temperature Pb-free solder paste alloy Durafuse®

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A close-up of a black computer chip on a green circuit board, enhanced by sintering paste, sparkles with glowing elements and intricate pathways.

Sintering Materials

Pressure or pressureless silver or copper sinter

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A syringe labeled "inTACK" with a clear plastic cap and an orange tip is set against a green gradient background.

InTACK®

Power electronics assembly, tacking agent, no-clean, no-residue, formic acid reflow, solder preforms, dies,

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Two green containers of Indium8.9HF halogen free solder paste 30, one tall and one short, are displayed on a white background.

Indium8.9HF Series

Best-selling solder pastes for high performance &

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Various solder alloys

Solder Alloys

Wide range of solder alloys with melting temperatures

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System in Package Solder Paste

Solder Pastes

Discover the wide selection of PCBA & semiconductor solder

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Bottles and containers of Indium GS-3434 Low Residue No-Clean Liquid Photovoltaic Flux on a dark background.

Fluxes

Wide portfolio of PCBA and semiconductor

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Thermal image of a circuit board showing heat distribution with red, yellow, and blue areas indicating temperature variations in electronic components and pathways.

Thermal Interface Materials

Metal-based TIMs offer low thermal resistance & customizable

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Five glass jars lay on a digital circuit board, each spilling a different colored powder: white, light green, light yellow, white, and red.

Compounds

High-purity indium, gallium, and germanium

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Various metal shapes, small components, and solder preform 140s are scattered around glass jars on a grid-patterned surface.

Solder Preforms

Solder preforms: versatile materials solving sealing & thermal

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Three spools of solder wire from Indium Corporation, with green and white labels, are stacked together.

Flux-Cored Wire

Top-quality flux-cored wire, conflict-free, void-free, low

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Related Applications

Futuristic white car with advanced power electronics zips through a neon-lit city at night, showcasing cutting-edge speed and technology.

Power Electronics Packaging & Assembly

Extensive range of proven high-reliability solder and more

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Microchips on a printed circuit board

PCB Assembly

Proven and cutting-edge materials for PCB assembly

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Close-up of a computer microchip on a green circuit board with visible electronic components and patterns.

Thermal Management

Thermal solutions for HPC ensuring reliability and optimal

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Close-up of a colorful patterned microchip surface with a grid-like structure and a reflective sheen.

Semiconductor Packaging & Assembly

Critical semiconductor packaging ensures functionality and

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Why Indium Corporation

Maximize Your Yield and Potential—Partner With Us Today

As a global leader known for our technical expertise and innovative solutions, we ensure that your products exceed industry standards, offering unmatched performance and reliability. Partner with us to experience cutting-edge technology and exceptional service—the Indium Corporation difference.

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Your Success
is Our Goal

Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.

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