The 48th International Symposium on Microelectronics (IMAPS) was held in Orlando, FL, USA last month, from October 26th through the 29th, 2015. I was able to attend as both as an exhibitor and as a session co-chair.
The Indium Corporation showcased several materials for thermal, power, and automotive electronics, including the following:
- Flux-coated solder preforms
- Gold-based solder alloys
- Metal TIMs (thermal interface materials)
If you are interested in one of the products above, please contact me with your questions or comments.
In addition to being an exhibitor, The Indium Corporation had several people involved with the technical sessions:
- Tim Jensen taught a PDC on Improving Mechanical, Electrical, and Thermal Reliability of Electronics Assemblies.
- Tim also was a session chair for the Advanced Materials & Processes session.
- Ed Briggs presented on Optimal SMT Electronics Assembly Guidelines for Stencil Printing
- Dr. Ning-Cheng Lee gave two presentations, one on High Reliability No-Clean Solder Paste for Designs where Flux cannot be Dried, and one on Porosity Evolution of Ag-Sintering at Die-Attach
- Herbert Ludowieg presented on Types of Solder Preforms and Difficult Geometries
- Brandon Judd presented on The Benefits of Flux-Coated Preforms in a QFN Assembly Process
- And I was a session chair for the 3D Solutions for Specific Applications for the Interposers & 2.5/3D Packaging session
If you were unable to attend the technical sessions and are interested in one of our papers please contact us. We look forward to hearing from you!
Indium Corporation also received the IMAPS 2015 Corporate Recognition Award. The award is given to a corporation that has made significant technical contributions to the microelectronics industry and exhibits strong support for IMAPS.
I look forward to hearing from you!