When the firsthigh-volume, automated, die-bonding machines for laser diode assembly were created, a single supplier dominated the market, providing all the solder materialneeded for this application. Generally used for manufacturing optical diode components in wireless communication and automotive applications, these die-bonding machines required a specific type of solder: 80Au20Sn ribbon < 0.1” wide. Furthermore, the ribbon needed to be packaged in longcontinuous lengths suitable for high volume manufacturing. When companies using this new technology began to branch out in search ofnew suppliers, Indium Corporation saw an opportunity to develop a superior product and enter this exciting regional market.
Pour ces systèmes d'alimentation automatique, la précision et la qualité du ruban et de la bobine sont de la plus haute importance, tout comme les grandes longueurs continues. Ces caractéristiques permettent de minimiser les temps d'arrêt de la production et de faciliter un processus efficace et à haut débit, ce qui se traduit par un produit final de haute qualité et un faible coût de propriété.
With investment and process improvement, Indium Corporation developed our AuLTRA™ Fine Ribbon! This is < 0.1” wide fine-grade, precision ribbon for high volume, fully automated laser diode assembly processes down to 0.010” width and 0.0006” thick capabilities. Our high quality, precision AuLTRA™ Fine Ribbon is designed for high volume production and is packaged on precision spools suitable for auto-feed systems. AuLTRA™ Fine Ribbon is available now in a broad range of sizes, with 15+ meters length per spool capabilities.
Si vous avez des questions, ou pour plus d'informations sur notre ruban AuLTRA™ Fine Ribbon, contactez-moi à l'adresse [email protected].
