When the firsthigh-volume, automated, die-bonding machines for laser diode assembly were created, a single supplier dominated the market, providing all the solder materialneeded for this application. Generally used for manufacturing optical diode components in wireless communication and automotive applications, these die-bonding machines required a specific type of solder: 80Au20Sn ribbon < 0.1” wide. Furthermore, the ribbon needed to be packaged in longcontinuous lengths suitable for high volume manufacturing. When companies using this new technology began to branch out in search ofnew suppliers, Indium Corporation saw an opportunity to develop a superior product and enter this exciting regional market.
对于这些自动供料系统来说，色带和卷轴的精度和质量以及长而连续的长度至关重要。这些特点有助于最大限度地减少生产停机时间，促进高效率、高吞吐量的生产流程，从而实现高质量的最终产品和低拥有成本。
With investment and process improvement, Indium Corporation developed our AuLTRA™ Fine Ribbon! This is < 0.1” wide fine-grade, precision ribbon for high volume, fully automated laser diode assembly processes down to 0.010” width and 0.0006” thick capabilities. Our high quality, precision AuLTRA™ Fine Ribbon is designed for high volume production and is packaged on precision spools suitable for auto-feed systems. AuLTRA™ Fine Ribbon is available now in a broad range of sizes, with 15+ meters length per spool capabilities.
如果您有任何疑问，或想了解有关 AuLTRA™ Fine 彩带的更多信息，请通过[email protected] 与我联系。
