When the firsthigh-volume, automated, die-bonding machines for laser diode assembly were created, a single supplier dominated the market, providing all the solder materialneeded for this application. Generally used for manufacturing optical diode components in wireless communication and automotive applications, these die-bonding machines required a specific type of solder: 80Au20Sn ribbon < 0.1” wide. Furthermore, the ribbon needed to be packaged in longcontinuous lengths suitable for high volume manufacturing. When companies using this new technology began to branch out in search ofnew suppliers, Indium Corporation saw an opportunity to develop a superior product and enter this exciting regional market.
對於這些自動進給系統，色帶和卷軸的精確度和品質以及長而連續的長度是最重要的。這些特性有助於將生產停機時間降至最低，並促進高效率、高產能的製程，從而獲得高品質的終端產品和低擁有成本。
With investment and process improvement, Indium Corporation developed our AuLTRA™ Fine Ribbon! This is < 0.1” wide fine-grade, precision ribbon for high volume, fully automated laser diode assembly processes down to 0.010” width and 0.0006” thick capabilities. Our high quality, precision AuLTRA™ Fine Ribbon is designed for high volume production and is packaged on precision spools suitable for auto-feed systems. AuLTRA™ Fine Ribbon is available now in a broad range of sizes, with 15+ meters length per spool capabilities.
如果您有任何問題，或需要更多關於我們 AuLTRA™ Fine 色帶的資訊，請與我聯絡[email protected]。
