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Indium Corporation Announces Ultrafine Dispensing Webinar

Indium CorporationKenneth Thum, Senior Technical Support Engineer, will host an InSIDER Series webinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 26 at 8 p.m. Eastern Time/Wednesday, Jan. 27 at 9 a.m. Singapore Time.

Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater. However, solder paste printing is not always possible in some packaging designs and solder paste dispensing can be an alternative method for solder paste deposition. Ultrafine solder paste dispensing is only achievable with the correct combination of dispensing equipment and solder materials. In Ultrafine Solder Paste Dispensing for Heterogeneous Integration, presenter Kenneth Thum will discuss different dispensing equipment technologies and important solder paste characteristics, along with sharing a solution for and steps on how to achieve consistent fine-dot dispensing.

A série InSIDER da Indium Corporations é um programa gratuito concebido para fornecer conteúdos técnicos especializados, partilhar conhecimentos do sector e promover o crescimento profissional utilizando uma plataforma virtual. Os webinars actuais e futuros podem ser encontrados em www.indium.com/webinar. 

Thum assists customers in Northern Malaysia and Thailand by troubleshooting issues and providing technical support for Indium Corporations full product range. He has over 10 years of experience in PCBA assembly and IC packaging. Thum earned his bachelors degree from the University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is a Certified SMT Process Engineer.

To register for Thums webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporations spam filters. This is a first-come, first-served event.

A Indium Corporation é um dos principais refinadores, fundidores, fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.

Para obter mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another (#FOETA), em www.facebook.com/indium ou @IndiumCorp.