Indium Corporations Kenneth Thum, Senior Technical Support Engineer, will host an InSIDER Series webinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 26 at 8 p.m. Eastern Time/Wednesday, Jan. 27 at 9 a.m. Singapore Time.
Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater. However, solder paste printing is not always possible in some packaging designs and solder paste dispensing can be an alternative method for solder paste deposition. Ultrafine solder paste dispensing is only achievable with the correct combination of dispensing equipment and solder materials. In Ultrafine Solder Paste Dispensing for Heterogeneous Integration, presenter Kenneth Thum will discuss different dispensing equipment technologies and important solder paste characteristics, along with sharing a solution for and steps on how to achieve consistent fine-dot dispensing.
インジウムコーポレーションのInSIDERシリーズは、専門的な技術コンテンツを提供し、業界の知識を共有し、仮想プラットフォームを使用して専門家の成長を促進するために設計された無料のプログラムです。現在および今後のウェビナーは、www.indium.com/webinar。
Thum assists customers in Northern Malaysia and Thailand by troubleshooting issues and providing technical support for Indium Corporations full product range. He has over 10 years of experience in PCBA assembly and IC packaging. Thum earned his bachelors degree from the University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is a Certified SMT Process Engineer.
To register for Thums webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporations spam filters. This is a first-come, first-served event.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧になるか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer To Another (#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
