Indium Corporations Kenneth Thum, Senior Technical Support Engineer, will host an InSIDER Series webinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 26 at 8 p.m. Eastern Time/Wednesday, Jan. 27 at 9 a.m. Singapore Time.
Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater. However, solder paste printing is not always possible in some packaging designs and solder paste dispensing can be an alternative method for solder paste deposition. Ultrafine solder paste dispensing is only achievable with the correct combination of dispensing equipment and solder materials. In Ultrafine Solder Paste Dispensing for Heterogeneous Integration, presenter Kenneth Thum will discuss different dispensing equipment technologies and important solder paste characteristics, along with sharing a solution for and steps on how to achieve consistent fine-dot dispensing.
Indium Corporations InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at indiumstg.wpenginepowered.com/webinar.
Thum assists customers in Northern Malaysia and Thailand by troubleshooting issues and providing technical support for Indium Corporations full product range. He has over 10 years of experience in PCBA assembly and IC packaging. Thum earned his bachelors degree from the University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is a Certified SMT Process Engineer.
To register for Thums webinar, visit indiumstg.wpenginepowered.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporations spam filters. This is a first-come, first-served event.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another (#FOETA), at www.facebook.com/indium or @IndiumCorp.
