Indium Corporation’s Ivan Castellanos, Technical Service Manager for Latin America, will present at InnovationsFORUM Mexico on June 14 in Guadalajara, Mexico.
Castellanos’ paper, QFN Void Reduction Through Profile, Stencil, and Paste Considerations, details the results of a thorough analysis and experimental plan to minimize voiding in QFN assembly, including process and materials parameters.
InnovationsFORUM is an event for electronics manufacturers to learn the most advanced technologies, materials, and processes. Register for free using the code IFM17_INDIUM at www.innovationsforummx.com.
Castellanos supports Indium Corporation’s electronics assembly, semiconductor fabrication and packaging, and thermal management markets. He is based in Guadalajara, Jalisco, Mexico, and has more than 15 years of experience in electronics assembly manufacturing, including SMT production troubleshooting. Castellanos has a diploma in Electronics and Communications Engineering and is an SMTA Certified SMT Process Engineer (CSMTPE). He has also earned his Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering and has worked for several major manufacturing companies, including Jabil Circuits in Guadalajara, Jalisco, Mexico.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
