Indium Corporation’s Ivan Castellanos, Technical Service Manager for Latin America, will present at InnovationsFORUM Mexico on June 14 in Guadalajara, Mexico.
Castellanos’ paper, QFN Void Reduction Through Profile, Stencil, and Paste Considerations, details the results of a thorough analysis and experimental plan to minimize voiding in QFN assembly, including process and materials parameters.
InnovationsFORUM is an event for electronics manufacturers to learn the most advanced technologies, materials, and processes. Register for free using the code IFM17_INDIUM at www.innovationsforummx.com.
Castellanos supports Indium Corporation’s electronics assembly, semiconductor fabrication and packaging, and thermal management markets. He is based in Guadalajara, Jalisco, Mexico, and has more than 15 years of experience in electronics assembly manufacturing, including SMT production troubleshooting. Castellanos has a diploma in Electronics and Communications Engineering and is an SMTA Certified SMT Process Engineer (CSMTPE). He has also earned his Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering and has worked for several major manufacturing companies, including Jabil Circuits in Guadalajara, Jalisco, Mexico.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、马来西亚、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
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