Indium Corporation’s Ivan Castellanos, Technical Service Manager for Latin America, will present at InnovationsFORUM Mexico on June 14 in Guadalajara, Mexico.
Castellanos’ paper, QFN Void Reduction Through Profile, Stencil, and Paste Considerations, details the results of a thorough analysis and experimental plan to minimize voiding in QFN assembly, including process and materials parameters.
InnovationsFORUM is an event for electronics manufacturers to learn the most advanced technologies, materials, and processes. Register for free using the code IFM17_INDIUM at www.innovationsforummx.com.
Castellanos supports Indium Corporation’s electronics assembly, semiconductor fabrication and packaging, and thermal management markets. He is based in Guadalajara, Jalisco, Mexico, and has more than 15 years of experience in electronics assembly manufacturing, including SMT production troubleshooting. Castellanos has a diploma in Electronics and Communications Engineering and is an SMTA Certified SMT Process Engineer (CSMTPE). He has also earned his Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering and has worked for several major manufacturing companies, including Jabil Circuits in Guadalajara, Jalisco, Mexico.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
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