Indium Corporation’s Jason Chou, Area Technical Manager for Taiwan, will share his technical expertise at TechXPOT at SEMICON Taiwan 2018 on Sept. 6 in Taipei, Taiwan.
The system-in-package (SiP) module market has grown significantly over the past several years because this process is capable of packing more functionality into a single package with a smaller form factor. However, SiP assembly presents challenges that impact yields. Chou will present SiP Package Process Challenge and Solution, which reviews an auger electron spectroscopy (AES) analysis that demonstrates how various reflow profiles, metal load, and the component’s surface contamination impact head-in-pillow defects in SiP assembly.
Chou provides technical support to Indium Corporation’s customers in Taiwan with a focus on the semiconductor industry. Chou earned his master’s degree in chemistry from National Tsing Hua University and his bachelor’s degree in chemistry from National Cheng Kung University. He has served as the group leader for the National Nano Device Laboratories in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
