Indium Corporation’s Jason Chou, Area Technical Manager for Taiwan, will share his technical expertise at TechXPOT at SEMICON Taiwan 2018 on Sept. 6 in Taipei, Taiwan.
The system-in-package (SiP) module market has grown significantly over the past several years because this process is capable of packing more functionality into a single package with a smaller form factor. However, SiP assembly presents challenges that impact yields. Chou will present SiP Package Process Challenge and Solution, which reviews an auger electron spectroscopy (AES) analysis that demonstrates how various reflow profiles, metal load, and the component’s surface contamination impact head-in-pillow defects in SiP assembly.
Chou provides technical support to Indium Corporation’s customers in Taiwan with a focus on the semiconductor industry. Chou earned his master’s degree in chemistry from National Tsing Hua University and his bachelor’s degree in chemistry from National Cheng Kung University. He has served as the group leader for the National Nano Device Laboratories in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、马来西亚、新加坡、韩国、英国和美国均设有工厂。
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