Indium Corporation’s Geoff Wang, Area Technical Manager for SMT, will share his technical expertise at the 2018 IPC Electronics Assembly High Reliability Technology Conference on Aug. 23 in Chengdu, China.
Wang’s presentation, The Impact of Solder Materials on Reliability, will show how materials can be used to solve some of the top challenges in the industry, including HIP, NWO, graping, and SIR performance.
Wang is based in Zhongshan, Guangdong, and provides technical support throughout southern China. He has more than a decade of surface mount technology (SMT) experience.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
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