Indium Corporation Expert to Present at the IPC Electronics Assembly High Reliability Technology Conference

Indium Corporation’s Geoff Wang, Area Technical Manager for SMT, will share his technical expertise at the 2018 IPC Electronics Assembly High Reliability Technology Conference on Aug. 23 in Chengdu, China.

Wang’s presentation, The Impact of Solder Materials on Reliability, will show how materials can be used to solve some of the top challenges in the industry, including HIP, NWO, graping, and SIR performance.

Wang is based in Zhongshan, Guangdong, and provides technical support throughout southern China. He has more than a decade of surface mount technology (SMT) experience.

Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil^®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。

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