Indium Corporation has released a new ball-attach flux, WS-829, designed for printing and pin transfer applications for the smallest sphere and high-density applications, including LED die-attach.
WS-829 is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard ball-grid array (BGA) manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging (WLP/PLP).
WS-829 features:
- Best-in-class flux residue cleanability when using only DI water; it also effectively cleans off contamination or pad oxidation from processes before ball mount
- High tackiness, which holds event the smallest solder spheres and LED die in place, and reduces missing balls or die skew defects
- A formulation that ensures consistent flux definition over long periods of time with minimal slump
Indium Corporation offers a robust portfolio of flux products designed for new or emerging industry challenges. To learn more about Indium Corporation’s fluxes, visit www.indium.com/ball-attach.
A Indium Corporation é um dos principais refinadores, fundidores, fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para obter mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
