Indium Corporation has released a new ball-attach flux, WS-829, designed for printing and pin transfer applications for the smallest sphere and high-density applications, including LED die-attach.
WS-829 is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard ball-grid array (BGA) manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging (WLP/PLP).
WS-829 features:
- Best-in-class flux residue cleanability when using only DI water; it also effectively cleans off contamination or pad oxidation from processes before ball mount
- High tackiness, which holds event the smallest solder spheres and LED die in place, and reduces missing balls or die skew defects
- A formulation that ensures consistent flux definition over long periods of time with minimal slump
Indium Corporation offers a robust portfolio of flux products designed for new or emerging industry challenges. To learn more about Indium Corporation’s fluxes, visit www.indium.com/ball-attach.
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer To Another® (#FOETA), en www.facebook.com/indium o @IndiumCorp.
