Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at Productronica, November 12-15, Munich, Germany.
Indium Corporation is redefining solder with its InFORMS® solder preforms and patent-pending solder ribbon. InFORMS® are a composite solder material with a reinforcing matrix. This results in:
- Improved mechanical and thermal reliability
- Uniform bondline thickness
- Desempenho de baixa evasão
InFORMS® do more than just bond two surfaces—they are designed to address specific challenges of the power electronics industry. InFORMS® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information about InFORMS®, visit indiumstg.wpenginepowered.com/informs or visit the Indium Corporation at Productronica, Hall A4, Booth 214.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
