Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at Productronica, November 12-15, Munich, Germany.
Indium Corporation is redefining solder with its InFORMS® solder preforms and patent-pending solder ribbon. InFORMS® are a composite solder material with a reinforcing matrix. This results in:
- Improved mechanical and thermal reliability
- Uniform bondline thickness
- Low-voiding performance
InFORMS® do more than just bond two surfaces—they are designed to address specific challenges of the power electronics industry. InFORMS® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information about InFORMS®, visit indiumstg.wpenginepowered.com/informs or visit the Indium Corporation at Productronica, Hall A4, Booth 214.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
