Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.
Indium Corporation’s metallic TIMs are easy to handle and rework. These products provide higher thermal conductivity as compared to polymer-based TIMs, making them ideal for die-attach, burn-in and test, IGBT applications, and almost any application where high performance thermal materials are required.
Metallic TIMs can be used as either a solder or compressible material:
- Solder TIMs, such as Solder Preforms, reflow and melt to form a mechanical bond
- Compressible TIMs, such as Heat-Spring® or non-reflow metals, like Liquid Metal, do not require heat and support temperature-sensitive applications
Indium Corporation’s metallic TIMs can be custom-made to your specifications with a variety of materials based on your product or process needs and include Pb-free options.
See our experts at the show or visit www.indium.com to learn more.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
