Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.
Indium Corporation’s metallic TIMs are easy to handle and rework. These products provide higher thermal conductivity as compared to polymer-based TIMs, making them ideal for die-attach, burn-in and test, IGBT applications, and almost any application where high performance thermal materials are required.
Metallic TIMs can be used as either a solder or compressible material:
- Solder TIMs, such as Solder Preforms, reflow and melt to form a mechanical bond
- Compressible TIMs, such as Heat-Spring® or non-reflow metals, like Liquid Metal, do not require heat and support temperature-sensitive applications
Indium Corporation’s metallic TIMs can be custom-made to your specifications with a variety of materials based on your product or process needs and include Pb-free options.
See our experts at the show or visit indiumstg.wpenginepowered.com to learn more.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
