Indium Corporation to Highlight Power Device Packaging Solutions at ECTC 2026

CLINTON, N.Y., May 21, 2026 – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation^® will showcase its high-reliability portfolio of products at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida.

A empresa irá apresentar os seguintes produtos:

Flip-Chip Flux:

• NC-809 is a no-clean, ultra-low residue, ball-attach flux. Its dual-purpose engineering provides high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
• WS-446HF Flux is a robust, halogen-free, water-wash flux designed to provide one simple solution to complicated applications, especially those with a single cleaning step, for both BGA ball-attach and flip-chip processes. Its powerful activator system promotes good wetting on even the most demanding substrate metallizations, such as Cu OSP, ENEPIG, and ENIG. Its rheology is suitable for dipping flip-chip applications, as well as pin transfer or printing BGA ball-attach applications, for sphere sizes 0.25 millimeters and above. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and electrochemical migration.

Sintering Paste:

• InBAKE™29 is a Cu sinter paste developed for power discrete die-attach applications and applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
• SiPaste^® C312HFis a cleanable solder paste formulated for fine-aperture printing applications. This material exhibits optimum transfer efficiency with consistent printing stability after continuous use and a long stencil life of at least four hours without dry-out. Its benign, non-corrosive residue can remain post-reflow without cleaning or be easily removed with semi-aqueous or saponifier technology.
• InFORCE^®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE^®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers. 

Thermal Solutions:

• Durafuse^® HT is an innovative high-temperature lead-free paste that is ideal for discrete power electronics devices. Durafuse^® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than those of a high-Pb solder. 
• Os materiais de interface térmica de solda(sTIMs) proporcionam uma dissipação de calor superior e elevada condutância térmica para dispositivos de alta densidade de potência que excedem os 1 000 watts. Otimizados para aplicações em pacotes BGA, os sTIMs proporcionam um desempenho com baixo teor de vazios e elevada fiabilidade ao longo de múltiplos ciclos de refluxo, garantindo estabilidade térmica. Ao contrário das soluções fluidas, garantem um desempenho fiável até ao fim da vida útil, evitando falhas comuns nas graxas. Ideais para dispositivos eletrónicos portáteis, os sTIMs aumentam a autonomia da bateria, reduzem o tamanho das ventoinhas de arrefecimento e minimizam a massa dos dissipadores de calor, mantendo simultaneamente a conformidade com a diretiva RoHS e apoiando iniciativas de sustentabilidade.
• Heat-Spring^® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring^® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
• Heat-Spring^® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/mK thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300microns to 1 millimeter, it can be customized with or without a diffusion barrierto prevent die staining.

To learn more about Indium Corporation’s semiconductor packaging and assembly solutions, visit indium.com or meet with our company experts at ECTC 2026, booth 240.

Sobre a Indium Corporation

^A Indium^{Corporation®} é uma empresa líder na refinação, fundição, fabrico e fornecimento de materiais para os mercados globais de eletrónica, semicondutores, películas finas e gestão térmica. Os seus produtos incluem soldas e fluxos; ligas de brasagem; materiais de interface térmica; alvos de pulverização catódica; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e^NanoFoil®. Fundada em 1934, a empresa dispõe de apoio técnico global e fábricas localizadas na China, Alemanha, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA. Para mais informações sobre a Indium Corporation, visite https://www.indium.com/ ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To^Another® (#FOETA), em www.linkedin.com/company/indium-corporation/.