CLINTON, N.Y., May 21, 2026 – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of products at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida.
The company will feature the following products:
Flip-Chip Flux:
- NC-809 is a no-clean, ultra-low residue, ball-attach flux. Its dual-purpose engineering provides high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
- WS-446HF Flux is a robust, halogen-free, water-wash flux designed to provide one simple solution to complicated applications, especially those with a single cleaning step, for both BGA ball-attach and flip-chip processes. Its powerful activator system promotes good wetting on even the most demanding substrate metallizations, such as Cu OSP, ENEPIG, and ENIG. Its rheology is suitable for dipping flip-chip applications, as well as pin transfer or printing BGA ball-attach applications, for sphere sizes 0.25 millimeters and above. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and electrochemical migration.
Sintering Paste:
- InBAKE™29 is a Cu sinter paste developed for power discrete die-attach applications and applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
- SiPaste® C312HFis a cleanable solder paste formulated for fine-aperture printing applications. This material exhibits optimum transfer efficiency with consistent printing stability after continuous use and a long stencil life of at least four hours without dry-out. Its benign, non-corrosive residue can remain post-reflow without cleaning or be easily removed with semi-aqueous or saponifier technology.
- InFORCE®29là dòng sản phẩm bột thiêu kết đồng (Cu) chịu áp lực, được thiết kế cho các ứng dụng yêu cầu độ tin cậy cao và độ dẫn nhiệt cao. Các ứng dụng củaInFORCE®29bao gồm gắn chip cho các thiết bị điện Si và SiC, cũng như gắn mô-đun điện trực tiếp lên bộ tản nhiệt.
Thermal Solutions:
- Durafuse® HT is an innovative high-temperature lead-free paste that is ideal for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than those of a high-Pb solder.
- Solder Thermal Interface Materials (sTIMs) deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, sTIMs enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, sTIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
- Heat-Spring® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/mK thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300microns to 1 millimeter, it can be customized with or without a diffusion barrierto prevent die staining.
To learn more about Indium Corporation’s semiconductor packaging and assembly solutions, visit indium.com or meet with our company experts at ECTC 2026, booth 240.
Giới thiệu về Indium Corporation
IndiumCorporation® là một trong những nhà tinh chế, luyện kim, sản xuất và cung cấp vật liệu hàng đầu cho các thị trường điện tử, bán dẫn, màng mỏng và quản lý nhiệt toàn cầu. Các sản phẩm bao gồm chất hàn và chất trợ hàn; vật liệu hàn cứng; vật liệu giao diện nhiệt; mục phún xạ; các kim loại và hợp chất vô cơ như indi, gali, germanium và thiếc; cùng vớiNanoFoil®. Được thành lập vào năm 1934, công ty có hệ thống hỗ trợ kỹ thuật toàn cầu và các nhà máy đặt tại Trung Quốc, Đức, Ấn Độ, Malaysia, Singapore, Hàn Quốc, Vương quốc Anh và Hoa Kỳ. Để biết thêm thông tin về Indium Corporation, vui lòng truy cập https://www.indium.com/ hoặc gửi email đến [email protected]. Bạn cũng có thể theo dõi các chuyên gia của chúng tôi, From One Engineer ToAnother® (#FOETA), tại www.linkedin.com/company/indium-corporation/.
