CLINTON, N.Y., May 21, 2026 – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of products at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida.
이 회사는 다음과 같은 제품을 선보일 예정입니다:
Flip-Chip Flux:
- NC-809 is a no-clean, ultra-low residue, ball-attach flux. Its dual-purpose engineering provides high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
- WS-446HF Flux is a robust, halogen-free, water-wash flux designed to provide one simple solution to complicated applications, especially those with a single cleaning step, for both BGA ball-attach and flip-chip processes. Its powerful activator system promotes good wetting on even the most demanding substrate metallizations, such as Cu OSP, ENEPIG, and ENIG. Its rheology is suitable for dipping flip-chip applications, as well as pin transfer or printing BGA ball-attach applications, for sphere sizes 0.25 millimeters and above. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and electrochemical migration.
Sintering Paste:
- InBAKE™29 is a Cu sinter paste developed for power discrete die-attach applications and applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
- SiPaste® C312HFis a cleanable solder paste formulated for fine-aperture printing applications. This material exhibits optimum transfer efficiency with consistent printing stability after continuous use and a long stencil life of at least four hours without dry-out. Its benign, non-corrosive residue can remain post-reflow without cleaning or be easily removed with semi-aqueous or saponifier technology.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
Thermal Solutions:
- Durafuse® HT is an innovative high-temperature lead-free paste that is ideal for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than those of a high-Pb solder.
- 솔더 열전도 재료(sTIM)는 1,000와트를 초과하는 고출력 장치에 탁월한 방열 성능과 높은 열전도도를 제공합니다. BGA 패키지 용도에 최적화된 sTIM은 여러 번의 리플로우 사이클에 걸쳐 공극이 적고 신뢰성이 높은 성능을 발휘하여 열적 안정성을 보장합니다. 유체 기반 솔루션과 달리, sTIM은 제품 수명 종료 시점까지 안정적인 성능을 보장하며, 그리스에서 흔히 발생하는 고장을 방지합니다. 휴대용 전자 기기에 이상적인 sTIM은 배터리 수명을 연장하고, 냉각 팬 크기를 줄이며, 방열판의 질량을 최소화하는 동시에 RoHS 규정을 준수하고 지속 가능성 이니셔티브를 지원합니다.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
- Heat-Spring® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/mK thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300microns to 1 millimeter, it can be customized with or without a diffusion barrierto prevent die staining.
To learn more about Indium Corporation’s semiconductor packaging and assembly solutions, visit indium.com or meet with our company experts at ECTC 2026, booth 240.
인디엄 코퍼레이션 소개
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. For more information about Indium Corporation, visit https://www.indium.com/ or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
