Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will lead a workshop titled Materials Considerations for Achieving High-Reliability Lead-Free Soldering at the LED Assembly, Reliability & Testing Symposium in Atlanta, Georgia on Dec. 1.
As the electronics industry rapidly advances toward miniaturization, two drivers dictate manufacturer success: low-cost and high-reliability. This course examines the roles of solder composition on cost and reliability, including a review of material properties, soldering performance, known failure modes, and the primary merits of alloys.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina, gestão térmica e solar. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
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