Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will lead a workshop titled Materials Considerations for Achieving High-Reliability Lead-Free Soldering at the LED Assembly, Reliability & Testing Symposium in Atlanta, Georgia on Dec. 1.
As the electronics industry rapidly advances toward miniaturization, two drivers dictate manufacturer success: low-cost and high-reliability. This course examines the roles of solder composition on cost and reliability, including a review of material properties, soldering performance, known failure modes, and the primary merits of alloys.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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