Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the 2014 China Solder Technology Forum and Exhibitions (CSTF) Aug. 26-27 in Shenzhen, China.
Dr. Lee’s presentation, Development of High-Temperature Lead-Free Materials, explores the performance of BiAgX®, a mixed powder solder paste system, and composite solder preforms. These technologies provide high-melting temperature and high-reliability solder joints, which enables the implementation of lead-free materials for high-temperature applications.
CSTF brings together leading companies and professionals to identify the soldering technology solutions and emerging trends that will shape the electronics industry’s future. For information, visit www.itri.com.cn.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, energia solar, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite indiumstg.wpenginepowered.com ou envie um e-mail para [email protected].
