Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the 2014 China Solder Technology Forum and Exhibitions (CSTF) Aug. 26-27 in Shenzhen, China.
Dr. Lee’s presentation, Development of High-Temperature Lead-Free Materials, explores the performance of BiAgX®, a mixed powder solder paste system, and composite solder preforms. These technologies provide high-melting temperature and high-reliability solder joints, which enables the implementation of lead-free materials for high-temperature applications.
CSTF brings together leading companies and professionals to identify the soldering technology solutions and emerging trends that will shape the electronics industry’s future. For information, visit www.itri.com.cn.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 indiumstg.wpenginepowered.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다.
