Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his expertise on Interconnect Materials for SiP Packaging at the inaugural SiP Conferences China 2017 on Oct. 19-20, in Shenzhen, China.
System-in-Package (SiP) technology is advancing quickly with components becoming smaller at each stage of development. To keep up with the ever-increasing demand for miniaturization, solder powder used to make SiP solder paste must become finer. In his presentation, Dr. Lee will explore if there is a limit to the solder powder size required for SiP applications, and how solder paste can support further SiP miniaturization.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
