Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his expertise on Interconnect Materials for SiP Packaging at the inaugural SiP Conferences China 2017 on Oct. 19-20, in Shenzhen, China.
System-in-Package (SiP) technology is advancing quickly with components becoming smaller at each stage of development. To keep up with the ever-increasing demand for miniaturization, solder powder used to make SiP solder paste must become finer. In his presentation, Dr. Lee will explore if there is a limit to the solder powder size required for SiP applications, and how solder paste can support further SiP miniaturization.
Lee 博士是世界知名的焊接專家、SMTA 優秀會員和 IEEE 會員。他在 SMT 用助焊劑、合金和焊膏的開發方面擁有豐富的經驗，在高溫聚合物、微電子封裝劑、填充劑和粘合劑的開發方面也有廣泛的經驗。除了 SMT 和半導體焊接材料之外，他的研究還延伸到奈米接合技術和導熱材料。
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
