Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China on March 14, 2016, in Shanghai, China.
Lim’s presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue,
no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process. This process produces devices targeted at smart internet-of-things (IoT) applications. These materials increase yield and reduce the time, cost, and resources needed for the SiP assembly process.
Ultra-low residue no-clean fluxes also help to Avoid the Void™ because the minimal flux residue left behind after soldering is compatible with the underfill or molding material used in encapsulation, thus eliminating the danger of delamination.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore and has 17 years of experience in the SMT and PCB assembly industries. She is an SMTA-certified process engineer and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina, gestão térmica e solar. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
