Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China on March 14, 2016, in Shanghai, China.
Lim’s presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue,
no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process. This process produces devices targeted at smart internet-of-things (IoT) applications. These materials increase yield and reduce the time, cost, and resources needed for the SiP assembly process.
Ultra-low residue no-clean fluxes also help to Avoid the Void™ because the minimal flux residue left behind after soldering is compatible with the underfill or molding material used in encapsulation, thus eliminating the danger of delamination.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore and has 17 years of experience in the SMT and PCB assembly industries. She is an SMTA-certified process engineer and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
铟泰公司 面向全球电子、半导体、薄膜、热管理及太阳能市场的顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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