Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the SMTA International Technical Conference (SMTAI) on Sept. 20 in Rosemont, Ill.
The discussion, led by Sandy-Smith and Co-Chair Eric Moen of Akrometrix, LLC, will cover Warpage Induced Defects and Component Warpage Limits. Panel participants include:
- Alex Chan, Nokia
- Martin Anselm, Rochester Institute of Technology
- Dudi Amir, Intel Corporation
- Neil Hubble, Akrometrix, LLC
The panel discussion is scheduled to start at 2 p.m. in the SMTAI Show Floor Theater. It will also be streamed live on Facebook. Go to www.facebook.com/indium for streaming details closer to the event date.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
