Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the SMTA International Technical Conference (SMTAI) on Sept. 20 in Rosemont, Ill.
The discussion, led by Sandy-Smith and Co-Chair Eric Moen of Akrometrix, LLC, will cover Warpage Induced Defects and Component Warpage Limits. Panel participants include:
- Alex Chan, Nokia
- Martin Anselm, Rochester Institute of Technology
- Dudi Amir, Intel Corporation
- Neil Hubble, Akrometrix, LLC
The panel discussion is scheduled to start at 2 p.m. in the SMTAI Show Floor Theater. It will also be streamed live on Facebook. Go to www.facebook.com/indium for streaming details closer to the event date.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
