Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the SMTA International Technical Conference (SMTAI) on Sept. 20 in Rosemont, Ill.
The discussion, led by Sandy-Smith and Co-Chair Eric Moen of Akrometrix, LLC, will cover Warpage Induced Defects and Component Warpage Limits. Panel participants include:
- Alex Chan, Nokia
- Martin Anselm, Rochester Institute of Technology
- Dudi Amir, Intel Corporation
- Neil Hubble, Akrometrix, LLC
The panel discussion is scheduled to start at 2 p.m. in the SMTAI Show Floor Theater. It will also be streamed live on Facebook. Go to www.facebook.com/indium for streaming details closer to the event date.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
