Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers Avoid the Void® at Productronica, November 14-17, in Munich, Germany.
The Indium8.9HF Series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding–plus improved stability–during the printing process. Under optimal process conditions, this series:
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- Duy trì hiệu suất in và hiệu suất in lại tuyệt vời sau khi để ở nhiệt độ phòng trong một tháng
- Delivers excellent response-to-pause even after being left on the stencil for 60 hours
The Indium8.9HF Solder Paste Series boasts a unique oxidation barrier technology that makes these pastes perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium Corporation’s low-voiding solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid or see Indium Corporation in hall A4 at booth 214.
Để biết thêm thông tin về Indium Corporation, vui lòng truy cậpindiumstg.wpenginepowered.comhoặc gửi emailđến [email protected]. Quý vị cũng có thể theo dõi các chuyên gia của chúng tôi, From One Engineer ToAnother®(#FOETA), tạiwww.facebook.com/indiumhoặc@IndiumCorp.
