Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers Avoid the Void® at Productronica, November 14-17, in Munich, Germany.
The Indium8.9HF Series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding–plus improved stability–during the printing process. Under optimal process conditions, this series:
- Zeigt bei Kühlung eine gleichbleibende Druckleistung von bis zu 12 Monaten
- Behält seine hervorragende Druck- und Reflow-Leistung bei, nachdem es einen Monat lang bei Raumtemperatur gelagert wurde
- Delivers excellent response-to-pause even after being left on the stencil for 60 hours
The Indium8.9HF Solder Paste Series boasts a unique oxidation barrier technology that makes these pastes perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium Corporation’s low-voiding solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid or see Indium Corporation in hall A4 at booth 214.
Weitere Informationen über die Indium Corporation finden Sie unterindiumstg.wpenginepowered.comoder per E-Mailan [email protected]. Sie können unseren Experten von „From One Engineer ToAnother®“(#FOETA) auch unterwww.facebook.com/indiumoder@IndiumCorp folgen.
