Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers Avoid the Void® at Productronica, November 14-17, in Munich, Germany.
The Indium8.9HF Series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding–plus improved stability–during the printing process. Under optimal process conditions, this series:
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- Mantiene eccellenti prestazioni di stampa e rifusione anche dopo un mese di permanenza a temperatura ambiente.
- Delivers excellent response-to-pause even after being left on the stencil for 60 hours
The Indium8.9HF Solder Paste Series boasts a unique oxidation barrier technology that makes these pastes perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium Corporation’s low-voiding solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid or see Indium Corporation in hall A4 at booth 214.
Per ulteriori informazioni su Indium Corporation, visitate il sitoindiumstg.wpenginepowered.como inviate un’e-mailall’indirizzo [email protected]. Potete inoltre seguire i nostri esperti, From One Engineer ToAnother®(#FOETA), suwww.facebook.com/indiumo su@IndiumCorp.
