Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers Avoid the Void® at Productronica, November 14-17, in Munich, Germany.
The Indium8.9HF Series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding–plus improved stability–during the printing process. Under optimal process conditions, this series:
- 냉장 보관 시 최대 12개월 동안 일관된 인쇄 성능을 발휘합니다.
- 실온에서 한 달 동안 보관해도 우수한 인쇄 및 리플로우 성능 유지
- 스텐실에 60시간 동안 방치한 후에도 뛰어난 응답성을 제공합니다.
The Indium8.9HF Solder Paste Series boasts a unique oxidation barrier technology that makes these pastes perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium Corporation’s low-voiding solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid or see Indium Corporation in hall A4 at booth 214.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
