Indium Corporation senior research chemist Mary Ma is set to deliver a technical presentation titled Printable Copper Sintering Paste for High-Power Die-Attach Applications at CSTIC, taking place in Shanghai, June 26-27.
Low-temperature copper (Cu) sintering paste, with high thermal and high electrical conductivity, is a promising material for die-attach applications in power electronics and third-generation semiconductor devices. Large size die-attach applications or IGBT modules require high efficiency printing transfer processes.
“As demand for high-power devices such as EVs and consumer electronics grows, so does the need for solder solutions that can meet the efficiency and operating temperature demands,” said Ma. “This paper elaborates on the influence of printing processes to obtain flat Cu paste deposit and high volume and I am honored to have the opportunity to present its findings at CSTIC.”
Ma is a senior research chemist in Research and Development at Indium Corporation. She joined Indium Corporation in 2010 and has more than ten years’ experience in the development of advanced materials which are applied in the semiconductor and electronics assembly industry. She has led the development of ultra-low-voiding solder paste and launched an advanced solder paste which was widely applied in the electronics assembly field. Ma is also responsible for product development for copper sintering materials which are used in advanced die-attach technology for semiconductors.
Giới thiệu về Indium Corporation
Tập đoàn Indium là một nhà tinh chế, nhà luyện kim, nhà sản xuất và nhà cung cấp vật liệu hàng đầu cho các thị trường điện tử, bán dẫn, màng mỏng và quản lý nhiệt toàn cầu. Các sản phẩm bao gồm chất hàn và chất trợ dung; chất hàn; vật liệu giao diện nhiệt; mục tiêu phun; kim loại indium, gali, germani và thiếc và các hợp chất vô cơ; và NanoFoil . Được thành lập vào năm 1934, công ty có hỗ trợ kỹ thuật toàn cầu và các nhà máy đặt tại Trung Quốc, Đức, Ấn Độ, Malaysia, Singapore, Hàn Quốc, Vương quốc Anh và Hoa Kỳ
Để biết thêm thông tin về Indium Corporation, hãy truy cập www.indium.com hoặc gửi email cho Jingya Huang . Bạn cũng có thể theo dõi các chuyên gia của chúng tôi, Từ kỹ sư này đến kỹ sư khác (#FOETA), tại www.linkedin.com/company/indium-corporation/ hoặc @IndiumCorp .
About CSTIC
CSTIC is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. It is organized by SEMI and IEEE and co-organized by the Institute of Microelectronics and Chinese Academy of Sciences. CSTIC 2023 will be held in conjunction with SEMICON China 2023. The conference will have nine symposiums covering all aspects of semiconductor technology with a focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as artificial intelligence (AI) chips, 6G chips, neuromorphic computing technology, advanced memory technology, 3D integration, MEMS technology, will also be addressed in the conference.
