Indium Corporation senior research chemist Mary Ma is set to deliver a technical presentation titled Printable Copper Sintering Paste for High-Power Die-Attach Applications at CSTIC, taking place in Shanghai, June 26-27.
Low-temperature copper (Cu) sintering paste, with high thermal and high electrical conductivity, is a promising material for die-attach applications in power electronics and third-generation semiconductor devices. Large size die-attach applications or IGBT modules require high efficiency printing transfer processes.
“As demand for high-power devices such as EVs and consumer electronics grows, so does the need for solder solutions that can meet the efficiency and operating temperature demands,” said Ma. “This paper elaborates on the influence of printing processes to obtain flat Cu paste deposit and high volume and I am honored to have the opportunity to present its findings at CSTIC.”
Ma is a senior research chemist in Research and Development at Indium Corporation. She joined Indium Corporation in 2010 and has more than ten years’ experience in the development of advanced materials which are applied in the semiconductor and electronics assembly industry. She has led the development of ultra-low-voiding solder paste and launched an advanced solder paste which was widely applied in the electronics assembly field. Ma is also responsible for product development for copper sintering materials which are used in advanced die-attach technology for semiconductors.
关于铟泰公司
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料提炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil 。公司成立于 1934 年，在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂，并提供全球技术支持。
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About CSTIC
CSTIC is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. It is organized by SEMI and IEEE and co-organized by the Institute of Microelectronics and Chinese Academy of Sciences. CSTIC 2023 will be held in conjunction with SEMICON China 2023. The conference will have nine symposiums covering all aspects of semiconductor technology with a focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as artificial intelligence (AI) chips, 6G chips, neuromorphic computing technology, advanced memory technology, 3D integration, MEMS technology, will also be addressed in the conference.
