Indium Corporation senior research chemist Mary Ma is set to deliver a technical presentation titled Printable Copper Sintering Paste for High-Power Die-Attach Applications at CSTIC, taking place in Shanghai, June 26-27.
Low-temperature copper (Cu) sintering paste, with high thermal and high electrical conductivity, is a promising material for die-attach applications in power electronics and third-generation semiconductor devices. Large size die-attach applications or IGBT modules require high efficiency printing transfer processes.
“As demand for high-power devices such as EVs and consumer electronics grows, so does the need for solder solutions that can meet the efficiency and operating temperature demands,” said Ma. “This paper elaborates on the influence of printing processes to obtain flat Cu paste deposit and high volume and I am honored to have the opportunity to present its findings at CSTIC.”
Ma is a senior research chemist in Research and Development at Indium Corporation. She joined Indium Corporation in 2010 and has more than ten years’ experience in the development of advanced materials which are applied in the semiconductor and electronics assembly industry. She has led the development of ultra-low-voiding solder paste and launched an advanced solder paste which was widely applied in the electronics assembly field. Ma is also responsible for product development for copper sintering materials which are used in advanced die-attach technology for semiconductors.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à Jingya Huang. Vous pouvez également suivre nos experts, From One Engineer To Another (#FOETA), sur www.linkedin.com/company/indium-corporation/ ou @IndiumCorp.
About CSTIC
CSTIC is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. It is organized by SEMI and IEEE and co-organized by the Institute of Microelectronics and Chinese Academy of Sciences. CSTIC 2023 will be held in conjunction with SEMICON China 2023. The conference will have nine symposiums covering all aspects of semiconductor technology with a focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as artificial intelligence (AI) chips, 6G chips, neuromorphic computing technology, advanced memory technology, 3D integration, MEMS technology, will also be addressed in the conference.
