Indium Corporation - Mailchimp

Voiding in Die-Attach Electronics Assembly

  • Avoid the Void
  • Voiding
  • Videos
  • This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences between the three main profile types.


    Keywords: indium, Indium Corporation, void, voiding, voids, Avoid the Void®, reflow, reflow profile, die-attach, die-attachment, thermal conductivity, Andy Mackie, diodes, triacs, solar