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Voiding in Die-Attach Electronics Assembly

This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences between the three main profile types.

 

Keywords: indium, Indium Corporation, void, voiding, voids, Avoid the Void®, reflow, reflow profile, die-attach, die-attachment, thermal conductivity, Andy Mackie, diodes, triacs, solar