Indium Corporation's Tim Jensen discusses voiding under QFN components, and how it is a significant challenge in the industry, especially for the thermal pad.
Keywords: Voiding, Tim Jensen, QFN Components, Thermal Pad, QFN, Indium Corporation, Indium, LV1000, Flux Coated Preform, Preforms, Tape and reel, Avoid the Void, [email protected]
In Part 2, we outlined materials challenges that can impact robotic soldering performance. In Part 3, we shift to product solutions and emerging innovations—highlighting how cored wire performance
In Part 1, we covered how robotic soldering evolved, and why materials quality is a major driver of process stability and precision. In Part 2, we focus on common materials-related issues that can
Silver prices are escalating rapidly, consistently trending upward. If you manage a bill of materials (BOM) for electronics manufacturing, you understand precisely how this volatility impacts your
