Indium Corporation 的 Tim Jensen 討論 QFN 元件下的空洞問題，以及它如何成為業界的一大挑戰，尤其是對於隔熱墊而言。
關鍵字：Voiding, Tim Jensen, QFN Components, Thermal Pad, QFN, Indium Corporation, Indium, LV1000, Flux Coated Preform, Preforms, Tape and reel, Avoid the Void, [email protected]
In Part 2, we outlined materials challenges that can impact robotic soldering performance. In Part 3, we shift to product solutions and emerging innovations—highlighting how cored wire performance
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